Verify the internal design, materials, construction, and workmanship of your electronic components with expert destructive physical analysis (DPA).

Destructive physical analysis is a testing process that helps to ensure electronic components are fabricated to the required standards. DPA can also be useful in uncovering process defects for identifying production lot problems.

Element's component analysis laboratories perform all major analytical functions like DPA, failure analysis (FA), counterfeit analysis, and material analysis on electronic components. Our DPA testing techniques align with industry standards and methods used in most military and space program requirements. Our expertise can help you resolve production challenges, uncover counterfeit parts, and build a better, more reliable product.

Destructive physical analysis test methods

Our standard DPA program includes external visual inspection (EVI), hermeticity testing, acoustic microscopy, decapsulation/delidding, internal visual inspection, bond pull testing, die shear testing, scanning electron microscopy/energy dispersive X-ray spectroscopy (SEM/EDS), X-ray radiography, X-ray fluorescence (XRF), microsection (cross-section) analysis, and optical microscopy.

We commonly perform DPA to MIL-STD-1580 using the test methods MIL-STD-202, MIL-STD-883, and MIL-STD-750

Counterfeit component investigations

Our counterfeit component test group includes industry experts and SAE committee chair working to develop the first industry-recognized test method standard to provide uniform requirements, practices and methods for testing electronic parts to mitigate the risks of receiving or using suspect counterfeit electronic parts.

Why choose Element?

Element has decades of experience performing destructive physical analysis and is well-versed in DPA procedures. In addition to the common industry standards, Element frequently performs client specified DPA test flows based on custom requirements. We provide a full-service laboratory with knowledgeable technicians and industry-leading technology, allowing us to perform a variety of testing services for PCBs, assemblies, and other electronic components, including in-depth failure analysis and investigations for counterfeit parts.

Contact our experts to learn how we can help you bring superior products to market.

We test your product to your specifications, but commonly required test techniques include:

  • Ball Shear Strength
  • Bond Strength
  • DC I.V. Curve Tracing
  • Die Shear Strength
  • Digital Microscopy
  • External Visual Inspection
  • Fluorescence Microscopy
  • Glassivation Layer Integrity
  • Sub-Micron Real Time X-ray
  • Internal Visual Inspection
  • Cross-Sectioning
  • Particle Impact Noise Detection
  • Scanning Electron Microscopy (SEM) Inspection
  • SEM Metallization Inspection
  • Solder Reflow/Moisture Sensitivity Testing
  • Glassivation Thickness
  • Metallization Thickness
  • Hermeticity Testing
  • SEM, XRF, and FTIR Elemental Analysis
  • Scanning Acoustic Microscopy (C Mode)
  • Ion Milling
  • Acid De-encapsulation
  • Sample De-lidding

Our team of over 9,000 Engaged Experts in North America, Europe, The Middle East, Australia, Asia and Africa are ready to help you.