Failure analysis helps you determine the root cause of an electronic component failure, and provides an opportunity to improve reliability, extrapolate life expectancy, and increase the performance of your product.
It requires specialized knowledge and expertise to evaluate the electronic elements of your product – including integrated circuits (ICs), printed circuit boards (PCBs), passive surface mount devices, materials, and assemblies – for the root causes of failure. Whether your components are cutting-edge marvels of engineering or trusted industry workhorses, Element’s experts can provide detailed information about their performance and any limitations relevant to their intended end-use application.
When is failure analysis necessary for electronics?
Anytime a component or material does not perform as expected, failure analysis is crucial to understand why. Electronic device failures are often uncovered during testing, but if problems are discovered with a device that is already on the market, failure analysis can offer insight into how to address the problem to protect your brand and prevent future failures. The information gained during the failure analysis process empowers you to take action to improve your product.
The Element advantage
Element’s testing professionals are trained to understand the entire product lifecycle for electronic devices and are experienced with a wide range of testing methodologies. Our system of labs tests everything from raw materials to fully assembled products, including devices for medical and military applications, where failure is not an option. Our unique perspective allows us to evaluate your product comprehensively and share thorough, actionable insight with you. We pride ourselves on being your partner in the testing and analysis process and are eager to support your success.
To learn more about our failure analysis services for electronic devices and components, contact our experts today.
Our capabilities for failure analysis include:
- Ball Shear and Die Shear Testing
- Curve Trace
- Decapsulation (De-Cap)
- Design of Experiments (DOE)
- Differential Scanning Calorimetry (DSC)
- Dynamic Mechanical Analysis (DMA)
- Electrical Characterization
- Fourier Transform Interferometry (FTIR)
- Fracture Evaluation
- Level I Analysis
- Material Characterization
- Microsectional Analysis (Cross-Section)
- Optical Inspection and external package analysis
- Scanning Acoustic Microscopy (CSAM)
- Scanning Electron Microscopy (SEM/EDS)
- Thermal Gravimetric Analysis (TGA)
- Thermal Mechanical Analysis (TMA)
- Wire bond pull testing
- X-Ray (Live-time, non-destructive inspection of package)
- X-Ray Fluorescence (XRF)
Find out how Element's global team of failure analysis experts learn from the past, to help prevent failures in service.
Battery Failure Analysis
Identify the root cause of battery failures and build better, safer products with data from Element’s comprehensive battery failure analysis.
Printed Circuit Board Testing
Ensure your printed circuit boards and finished printed circuit assemblies are of the highest quality and compliant with relevant standards with comprehensive PCB testing from Element.
Electronics Test Methods
Element’s team of experts helps design and implement test methods for virtually any electronic equipment, from automotive components to medical devices.