Accurate PCB cross-section analysis is essential to ensure the integrity of your printed circuit boards.

PCB microsectioning, also called cross-section analysis, remains the most widely accepted method of analyzing the through-hole integrity of a PCB or PWB. PCBs are comprised of many different materials such as glass, aramid fibers, kapton, copper, acrylic adhesive, epoxy, polyimide, Teflon, and solder. Each of these materials has a different relative hardness and, coupled with that of the mounting media such as epoxy or acrylic, makes the PCB cross section analysis difficult to perform.

PCB microsection analysis requires specialized skill and expertise, as the process is very delicate. It is essential to complete the PCB cross-sectional preparation in an area within 10% of the center of the plated-through hole.

Microsection preparation and analysis training

In addition to our microsection analysis test service, Element can also provide your in-house staff with the training required to improve the quality of your PCB microsections with hands-on training either in one of our laboratories or on-site at your facility.

The Element advantage

Element’s expert staff uses cutting-edge equipment to accurately cross section high-aspect ratio PCBs, including blind and buried via holes down to 0.001”, SMT devices, and solder joints. Whether you require regular conformance cross-section analysis, failure analysis, vendor qualification, or lot verification, Element has the experience and knowledge to provide you with the highest quality testing and fastest turnaround available. All of Element’s test inspection personnel for PCB analysis and PCBA analysis are certified to IPC-A-600 and IPC-A-610 visual acceptability standards.

Contact our experts today to start your project. 

  • IPC-A-600 – Acceptability of Printed Boards
  • IPC-A-610 – Acceptability of Electronic Assemblies
  • IPC-6012 – Qualification and Performance for Rigid Printed Boards
  • IPC-6013 – Qualification and Performance for Flexible Printed Boards
  • IPC-6016 – Qualification and Performance for High Density Interconnect (HDI) on Layers or Boards
  • IPC-6018 – Microwave End Product Board Inspection and Test
  • IPC-TM-650 – Test Methods Manual
  • MIL-PRF-55110 – Performance Specification – General Specification for Printed Wiring Board, Rigid
  • MIL-PRF-31032 – Performance Specification – General Specification for Printed Circuit Board/Printed Wiring
  • MIL-P-50884 – General Specification for Printed-Wiring, Flexible and Rigid-Flex
  • GMW 3172 Cross Section Testing – General Specification for Electrical/Electronic Components – Environmental/Durability

Our team of over 9,000 Engaged Experts in North America, Europe, The Middle East, Australia, Asia and Africa are ready to help you.